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TSMC Announces Completion of 45nm Immersion Lithography Process

Today, the results of test “runs” of the TSMC technological line, which uses immersion lithography technology, have become known. The company reported that the parameters of the resulting wafers are “acceptable for mass production”. TSMC researchers intend to present a more detailed report on their work tomorrow at the SPIE Microlithography Conference.

Recall that immersion lithography is largely based on the existing “dry” lithography – a process in which machines are involved, somewhat reminiscent of the principle of operation of photographic enlargers. Extending the life of this technology at the time of the transition to 45 nm and less would be a good development option for the near future for the entire industry. In immersion lithography, a liquid, not a gaseous medium serves for image transfer. By placing it between the lithographic optics and the semiconductor plate, it is possible to increase the resolution of the system, and, consequently, to reduce the size of the elements formed on the semiconductor surface.

As you know, where the water is, there are pitfalls. The use of a liquid medium leads to the need to deal with defects, such as bubbles, the effect of liquid on the photoresist. Nevertheless, the researchers from TSMC managed to overcome the difficulties encountered and get a good result. According to the company, no more than seven defects were recorded on test 300-mm plates, caused by the use of immersion technology – this corresponds to a density of 0.014 defects per sq.cm.

TSMC immersion lithography equipment is designed for 45nm production.

Well, it looks like it is immersion lithography that will become the successor to the existing technology. As far as we know, other developments are still far from being considered suitable for mass production.

Source: TSMC

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