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Spansion Introduces 90nm 1Gbps MCP ORNAND Memory
Spansion, a joint venture between AMD and Fujitsu, said that the company plans to start shipping trial copies of flash memory chips based on ORNAND technology. The microcircuits will be made using MCP technology (multi cell package) in compliance with the standards of the 90-nm technological process and will provide a density of 1 Gbit. ORNAND Spansion flash memory positions for use in mobile phones.
The source notes that Spansion has officially confirmed its intention to start shipping trial copies later this year, adding that it plans to release a 2-Gbps version next year.
The 1-Gbit MCP will also include MirrorBit NOR flash memory and 1T pseudo-static RAM (1T PSRAM). Spansion plans to produce 90nm ORNAND chips at Fab 25 in Austin, Texas.
Recall that the ORNAND architecture combines (as far as possible) the advantages of NAND and NOR – high density and fast read / write speed. Cell phone manufacturers who wish to use Spansion’s MCP solutions will also be able to use onboard NOR memory.