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Infineon Tests 65nm Technology at Partner Factories
In collaboration with IBM, Chartered Semiconductors and Samsung, Infineon released the first logic chip designs using 65nm process technology.
The samples in question are intended to test products developed by the company: in particular, the microprocessor on the ARM9 core and the digital signal processor (DSP) core, which will be used as nodes in the design of microcircuits for cell phones. In addition, the sample crystals contained several library elements and macros, memory elements (SRAM, ROM), RF blocks and mixed signal processing circuits.
In the first phase, Infineon expects to use 65nm technology in the element base sector for cell phones. For example, a microcircuit that will integrate digital and radio frequency circuits will become the basis for low-cost devices. Previews will begin shipping to customers this quarter, with mass production slated to roll out by the fourth quarter of this year. 2021.
The company is moving away from using its own facilities. It is known that Infineon did not plan to master the production of logic microcircuits at rates less than 90 nm in its production. The test samples in question were produced at IBM factories in New York and Chartered Semiconductors in Singapore. The strategic line of the company’s development provides for the mass production of products at the facilities of Chartered Semiconductor. Thus, Infineon expects to master modern technologies without making large capital investments in the construction of its own 65nm factory.
Recall that we are talking about logical microcircuits and does not apply to dynamic memory. For the latter, Infineon, in collaboration with Taiwanese company Nanya Technology, develops a 70nm process. The first product samples were received a few months ago, the work is going according to plan.
Source: EE Times