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Get Help Fast.[Motherboard] Update mode for Intel ME driver | Official Support | ASUS Global


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Asus Rog Maximus Ix Code Driver
SM Bus Controller is not installed?
SM Bus Controller is not installed?
IDF Reveals Conroe, Woodcrest, Merom, Kentsfield and Clovertown

Intel officially confirmed socket types for the first two dual-core processors based on the next-generation Intel Core micro-architecture and manufactured using the 65nm process technology – Conroe and Woodcrest at the IDF developer forum in Taiwan.

Conroe, designed for desktop systems, will use LGA 775 packaging, according to Dan Casaletto, Intel’s head of microprocessor architecture and planning.
Woodcrest, which will find its place in dual-processor servers and workstations, is designed for the LGA 771 socket, motherboards with which will appear on the market simultaneously with the upcoming launch of the Xeon, produced using a 65nm process technology (the so-called Dempsey). Note that Dempsey is not based on Intel Core architecture.

Both Conroe and Woodcrest will enter the market in the third quarter of this year. In addition, Casaletto said the first quad-core desktop (Kentsfield) and dual-processor servers and workstations (Clovertown) will be pin-compatible with Conroe and Woodcrest, respectively.

As far as dual-core Intel Core notebook processors (Merom) are concerned, things are much more obscure. Casaletto said that initially they will be identical in pins with the Core Duo and Core Solo, to ensure compatibility with the Napa platform (these processors are available in 478-pin mPGA and 479-pin mBGA packages). And next year, with the release of the Santa Rosa platform, there will be a transition to a new socket.

We also add that Intel now has three lines for the production of 65 nm processors (two in Oregon and one in Arizona). This year the company is going to launch another one in Ireland.

Source: DigiTimes

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