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55nm immersion lithography goes into serial production

Nikon ships the world’s first 55nm batch immersion lithography system. Information about the customer was not disclosed, it is only known that we are talking about one of the largest manufacturers of semiconductor products.

The NSR-S609B system is designed for serial production of semiconductor memory at 55 nm. It can be used in the development of 45 nm devices.

Among the features of the novelty, the manufacturer singles out the “local filling technology” (Local Fill Technology) and the “two-stage approach” (Tandem Stage). Local Fill Technology eliminates wafer defects and prevents immersion liquid from evaporating. Tandem Stage helps improve system performance, accuracy and long-term stability. The essence of the Tandem Stage is to divide the work into two stages: at the “Exposure Stage” the plates are processed at a high speed, and at the “Calibration Stage” the device is set up. Calibration is performed with every insert change. As a result, according to the developer, it was possible to bring the scanner positioning accuracy to 7 nm or less.

Source: Nikon Corporation

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