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Waiting for regional IDFs: waiting for ONFI details

As it has long become a tradition, at each of its developer forums (IDF) Intel talks about some new (and each time – different) technology. This time, at the upcoming (April 10-11) Taiwanese forum, a detailed story about the ONFI (Open NAND Flash Interface) initiative is expected.

During the spring IDF held in March in San Francisco, Intel emphasized that ONFI is not another flash memory card standard, but is intended to ensure compatibility of some NAND flash devices with others. To do this, it is proposed to introduce as a de facto standard the unified pinout of TSOP (48 pins) and LGA packages (52 pins). In addition to pinout, it is planned to unify the command system, which will provide for the chip self-identification function.

And now the main thing is that the ONFI interface, according to the source, will be used in the already sensational Robson technology. Robson technology is expected to be available in notebooks based on the Santa Rosa platform, and its essence boils down to using the buffer flash memory on the MiniPCI board to record the most frequently used applications.

On a more global scale, there is no industry group to promote ONFI officially yet. However, even during the spring IDF in San Francisco, unnamed partners were mentioned, by which, most of all, Micron was meant, participating with Intel in the joint venture IM Flash.

It’s also worth noting that Intel is likely planning to replicate its DRAM approach to memory technology standardization with flash. After all, Intel does not manufacture NAND flash itself, but gets it from IM Flash, most of which is intended for Apple.

Anyway, the upcoming Taiwanese IDF promises to be interesting. In addition, IDF will be held in Japan, Tokyo, Beijing, Moscow, Shanghai and Cairo.

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