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Intel invests 650 million. dollars in the development of production of 300-mm substrates
Intel Corporation Announces $ 650 Million Investment Expansion to 300mm Substrates at Fab 11X in Rio Rancho, NM.
“This will help us better meet our customers’ needs,” said Paul Otellini, President of Intel Corporation. –
Further ramping up production of 300mm substrates will help improve the overall economic performance of our international manufacturing network. “.
Construction and installation of new equipment will be carried out during 2021, and already at the beginning of 2021, new production facilities at Fab 11X will be commissioned. Thus, one more step will be taken to achieve the strategic goal of Intel Corporation – to increase the production of 300-mm substrates for the production of products in 90-nm, 65-nm
and future technologies for the production of microcircuits. 300mm wafers are currently manufactured at four Intel factories: Fab 11X, D1D and D1C in Oregon and Fab 24 in Ireland.
The production of 300 mm substrates expands the possibilities of producing cheaper semiconductors compared to the more common 200 mm substrates. The total area of semiconductor elements on 300-mm substrates is 225% larger than the area of 200-mm substrates, as a result of which they fit 240% more microcircuits. In addition, increasing the size of the substrates reduces the cost of manufacturing each chip and optimizes the use of resources.