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Download Acer Veriton XG Intel Chipset Driver for Windows 8 64 bit

Product Support | Acer Indonesia
Possibilities of lithography at 32 nm standards remain questionable

Yesterday we talked about the success of IBM in the development of new frontiers of ultraviolet immersion lithography. It would seem that semiconductor manufacturers received hope that existing technologies will allow them to hold out until new developments approach. However, not all so simple. The use of lithography is still a big question when it comes to the 32 nm rate, which is tentatively expected to be mastered in 2021. The source talks about the concerns that experts from the Belgian research organization IMEC shared yesterday at the SPIE Microlithography conference.

The fact is that there is no consensus in the industry which of the varieties of lithographic technology can be used in the transition to the 32nm process. So far, three candidate technologies have emerged: ultraviolet (EUV), 193nm immersion (used in the development of IBM) and double exposure technology.

IMEC’s ​​193nm Immersion and Double Exposure Technology Is “Least Risky”. In its laboratory, IMEC succeeded using 193-nm immersion technology to produce elements with a size of 40 nm. The use of immersion fluids of the second and third generation with refractive indices of 1.65 and 1.8, theoretically, can work with 32 nm norms. Scientists are working on the creation of such fluids.

Disadvantages of double exposure technology – increased cost, complication and lengthening of the production cycle.

With regard to EUV, the main problems of this technology are the resolution and sensitivity of the photoresist, inhomogeneity of the line edges. In addition, new radiation sources are needed for EUV. Condenser life for EUV is now less than one month. Earlier it was expected that by 2021 it will be possible to create a device with a lifespan of four years.

Could such difficulties stop EUV stalwarts?? According to the source, finding itself without the appropriate equipment and materials by the previously scheduled date, Intel put aside plans to introduce EUV in serial production at 32 nm by 2021. Instead, Intel is now betting on 193nm lithography.

Source: EE Times

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